|
TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTS4RKednc |
|
#4RKednc |
STRESS4RKednc |
ABV4RKednc |
SAMPLE SIZE / LOT4RKednc |
|
A14RKednc |
Preconditioning4RKednc |
PC4RKednc |
774RKednc |
|
A24RKednc |
Temperature Humidity-Bias or Biased HAST4RKednc |
THB or HAST4RKednc |
774RKednc |
|
A34RKednc |
Autoclave or Unbiased HAST or Temperature Humidity (without Bias)4RKednc |
AC or UHST or TH4RKednc |
774RKednc |
|
A44RKednc |
Temperature Cycling4RKednc |
TC4RKednc |
774RKednc |
|
A54RKednc |
Power Temperature Cycling4RKednc |
PTC4RKednc |
454RKednc |
|
A64RKednc |
High Temperature Storage Life4RKednc |
HTSL4RKednc |
454RKednc |
|
TEST GROUP B – ACCELERATED LIFET4RKednc |
|
#4RKednc |
STRESS4RKednc |
ABV4RKednc |
SAMPLE SIZE / LOT4RKednc |
|
B14RKednc |
High Temperature Operating Life4RKednc |
HTOL4RKednc |
774RKednc |
|
B24RKednc |
Early Life Failure Rate4RKednc |
ELFR4RKednc |
8004RKednc |
|
B34RKednc |
NVM Endurance, Data Retention, and Operational Life4RKednc |
EDR4RKednc |
774RKednc |
|
TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTS4RKednc |
|
#4RKednc |
STRESS4RKednc |
ABV4RKednc |
SAMPLE SIZE / LOT4RKednc |
|
C14RKednc |
Wire Bond Shear4RKednc |
WBS4RKednc |
30 bonds from a minimum of 5 devices4RKednc |
|
C24RKednc |
Wire Bond Pull4RKednc |
WBP4RKednc |
|
C34RKednc |
Solderability4RKednc |
SD4RKednc |
154RKednc |
|
C44RKednc |
Physical Dimensions4RKednc |
PD4RKednc |
104RKednc |
|
C54RKednc |
Solder Ball Shear4RKednc |
SBS4RKednc |
5 balls from a min. of 10 devices4RKednc |
|
C64RKednc |
Lead Integrity4RKednc |
LI4RKednc |
from each 10 leads4RKednc
of 5 parts4RKednc |
|
TEST GROUP D – DIE FABRICATION RELIABILITY TESTS4RKednc |
|
#4RKednc |
STRESS4RKednc |
ABV4RKednc |
SAMPLE SIZE / LOT4RKednc |
|
D14RKednc |
Electromigration4RKednc |
EM4RKednc |
---4RKednc |
|
D24RKednc |
Time Dependent Dielectric Breakdown4RKednc |
TDDB4RKednc |
---4RKednc |
|
D34RKednc |
Hot Carrier Injection4RKednc |
HCI4RKednc |
---4RKednc |
|
D44RKednc |
Negative Bias Temperature Instability4RKednc |
NBTI4RKednc |
---4RKednc |
|
D54RKednc |
Stress Migration4RKednc |
SM4RKednc |
---4RKednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTS4RKednc |
|
#4RKednc |
STRESS4RKednc |
ABV4RKednc |
SAMPLE SIZE / LOT4RKednc |
|
E14RKednc |
Pre- and Post-Stress Function/Parameter4RKednc |
TEST4RKednc |
All4RKednc |
|
E24RKednc |
Electrostatic Discharge Human Body Model4RKednc |
HBM4RKednc |
See Test Method4RKednc |
|
E34RKednc |
Electrostatic Discharge Charged Device Model4RKednc |
CDM4RKednc |
See Test Method4RKednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTS (CONTINUED)4RKednc |
|
#4RKednc |
STRESS4RKednc |
ABV4RKednc |
SAMPLE SIZE / LOT4RKednc |
|
E44RKednc |
Latch-Up4RKednc |
LU4RKednc |
64RKednc |
|
E54RKednc |
Electrical Distributions4RKednc |
ED4RKednc |
304RKednc |
|
E64RKednc |
Fault Grading4RKednc |
FG4RKednc |
---4RKednc |
|
E74RKednc |
Characterization4RKednc |
CHAR4RKednc |
---4RKednc |
|
E94RKednc |
Electromagnetic Compatibility4RKednc |
EMC4RKednc |
14RKednc |
|
E104RKednc |
Short Circuit Characterization4RKednc |
SC4RKednc |
104RKednc |
|
E114RKednc |
Soft Error Rate4RKednc |
SER4RKednc |
34RKednc |
|
E124RKednc |
Lead (Pb) Free4RKednc |
LF4RKednc |
See Test Method4RKednc |
|
TEST GROUP F – DEFECT SCREENING TESTS4RKednc |
|
#4RKednc |
STRESS4RKednc |
ABV4RKednc |
SAMPLE SIZE / LOT4RKednc |
|
F14RKednc |
Process Average Testing4RKednc |
PAT4RKednc |
---4RKednc |
|
F24RKednc |
Statistical Bin/Yield Analysis4RKednc |
SBA4RKednc |
---4RKednc |
|
TEST GROUP G – CAVITY PACKAGE INTEGRITY TESTS4RKednc |
|
#4RKednc |
STRESS4RKednc |
ABV4RKednc |
SAMPLE SIZE / LOT4RKednc |
|
G14RKednc |
Mechanical Shock4RKednc |
MS4RKednc |
154RKednc |
|
G24RKednc |
Variable Frequency Vibration4RKednc |
VFV4RKednc |
154RKednc |
|
G34RKednc |
Constant Acceleration4RKednc |
CA4RKednc |
154RKednc |
|
G44RKednc |
Gross/Fine Leak4RKednc |
GFL4RKednc |
154RKednc |
|
G54RKednc |
Package Drop4RKednc |
DROP4RKednc |
54RKednc |
|
G64RKednc |
Lid Torque4RKednc |
LT4RKednc |
54RKednc |
|
G74RKednc |
Die Shear4RKednc |
DS4RKednc |
54RKednc |
|
G84RKednc |
Internal Water Vapor4RKednc |
IWV4RKednc |
54RKednc
满足AEC-Q100仅仅只是车规芯片的第一步，其实要求真正的达到车规芯片的质量，还需要从设计开发流程体系，生产制造体系各个方面来把控，才能真正的满足汽车的质量要求。
|
最前沿的电子设计资讯
