|
TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTSAOwednc |
|
#AOwednc |
STRESSAOwednc |
ABVAOwednc |
SAMPLE SIZE / LOTAOwednc |
|
A1AOwednc |
PreconditioningAOwednc |
PCAOwednc |
77AOwednc |
|
A2AOwednc |
Temperature Humidity-Bias or Biased HASTAOwednc |
THB or HASTAOwednc |
77AOwednc |
|
A3AOwednc |
Autoclave or Unbiased HAST or Temperature Humidity (without Bias)AOwednc |
AC or UHST or THAOwednc |
77AOwednc |
|
A4AOwednc |
Temperature CyclingAOwednc |
TCAOwednc |
77AOwednc |
|
A5AOwednc |
Power Temperature CyclingAOwednc |
PTCAOwednc |
45AOwednc |
|
A6AOwednc |
High Temperature Storage LifeAOwednc |
HTSLAOwednc |
45AOwednc |
|
TEST GROUP B – ACCELERATED LIFETAOwednc |
|
#AOwednc |
STRESSAOwednc |
ABVAOwednc |
SAMPLE SIZE / LOTAOwednc |
|
B1AOwednc |
High Temperature Operating LifeAOwednc |
HTOLAOwednc |
77AOwednc |
|
B2AOwednc |
Early Life Failure RateAOwednc |
ELFRAOwednc |
800AOwednc |
|
B3AOwednc |
NVM Endurance, Data Retention, and Operational LifeAOwednc |
EDRAOwednc |
77AOwednc |
|
TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTSAOwednc |
|
#AOwednc |
STRESSAOwednc |
ABVAOwednc |
SAMPLE SIZE / LOTAOwednc |
|
C1AOwednc |
Wire Bond ShearAOwednc |
WBSAOwednc |
30 bonds from a minimum of 5 devicesAOwednc |
|
C2AOwednc |
Wire Bond PullAOwednc |
WBPAOwednc |
|
C3AOwednc |
SolderabilityAOwednc |
SDAOwednc |
15AOwednc |
|
C4AOwednc |
Physical DimensionsAOwednc |
PDAOwednc |
10AOwednc |
|
C5AOwednc |
Solder Ball ShearAOwednc |
SBSAOwednc |
5 balls from a min. of 10 devicesAOwednc |
|
C6AOwednc |
Lead IntegrityAOwednc |
LIAOwednc |
from each 10 leadsAOwednc
of 5 partsAOwednc |
|
TEST GROUP D – DIE FABRICATION RELIABILITY TESTSAOwednc |
|
#AOwednc |
STRESSAOwednc |
ABVAOwednc |
SAMPLE SIZE / LOTAOwednc |
|
D1AOwednc |
ElectromigrationAOwednc |
EMAOwednc |
---AOwednc |
|
D2AOwednc |
Time Dependent Dielectric BreakdownAOwednc |
TDDBAOwednc |
---AOwednc |
|
D3AOwednc |
Hot Carrier InjectionAOwednc |
HCIAOwednc |
---AOwednc |
|
D4AOwednc |
Negative Bias Temperature InstabilityAOwednc |
NBTIAOwednc |
---AOwednc |
|
D5AOwednc |
Stress MigrationAOwednc |
SMAOwednc |
---AOwednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTSAOwednc |
|
#AOwednc |
STRESSAOwednc |
ABVAOwednc |
SAMPLE SIZE / LOTAOwednc |
|
E1AOwednc |
Pre- and Post-Stress Function/ParameterAOwednc |
TESTAOwednc |
AllAOwednc |
|
E2AOwednc |
Electrostatic Discharge Human Body ModelAOwednc |
HBMAOwednc |
See Test MethodAOwednc |
|
E3AOwednc |
Electrostatic Discharge Charged Device ModelAOwednc |
CDMAOwednc |
See Test MethodAOwednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTS (CONTINUED)AOwednc |
|
#AOwednc |
STRESSAOwednc |
ABVAOwednc |
SAMPLE SIZE / LOTAOwednc |
|
E4AOwednc |
Latch-UpAOwednc |
LUAOwednc |
6AOwednc |
|
E5AOwednc |
Electrical DistributionsAOwednc |
EDAOwednc |
30AOwednc |
|
E6AOwednc |
Fault GradingAOwednc |
FGAOwednc |
---AOwednc |
|
E7AOwednc |
CharacterizationAOwednc |
CHARAOwednc |
---AOwednc |
|
E9AOwednc |
Electromagnetic CompatibilityAOwednc |
EMCAOwednc |
1AOwednc |
|
E10AOwednc |
Short Circuit CharacterizationAOwednc |
SCAOwednc |
10AOwednc |
|
E11AOwednc |
Soft Error RateAOwednc |
SERAOwednc |
3AOwednc |
|
E12AOwednc |
Lead (Pb) FreeAOwednc |
LFAOwednc |
See Test MethodAOwednc |
|
TEST GROUP F – DEFECT SCREENING TESTSAOwednc |
|
#AOwednc |
STRESSAOwednc |
ABVAOwednc |
SAMPLE SIZE / LOTAOwednc |
|
F1AOwednc |
Process Average TestingAOwednc |
PATAOwednc |
---AOwednc |
|
F2AOwednc |
Statistical Bin/Yield AnalysisAOwednc |
SBAAOwednc |
---AOwednc |
|
TEST GROUP G – CAVITY PACKAGE INTEGRITY TESTSAOwednc |
|
#AOwednc |
STRESSAOwednc |
ABVAOwednc |
SAMPLE SIZE / LOTAOwednc |
|
G1AOwednc |
Mechanical ShockAOwednc |
MSAOwednc |
15AOwednc |
|
G2AOwednc |
Variable Frequency VibrationAOwednc |
VFVAOwednc |
15AOwednc |
|
G3AOwednc |
Constant AccelerationAOwednc |
CAAOwednc |
15AOwednc |
|
G4AOwednc |
Gross/Fine LeakAOwednc |
GFLAOwednc |
15AOwednc |
|
G5AOwednc |
Package DropAOwednc |
DROPAOwednc |
5AOwednc |
|
G6AOwednc |
Lid TorqueAOwednc |
LTAOwednc |
5AOwednc |
|
G7AOwednc |
Die ShearAOwednc |
DSAOwednc |
5AOwednc |
|
G8AOwednc |
Internal Water VaporAOwednc |
IWVAOwednc |
5AOwednc
满足AEC-Q100仅仅只是车规芯片的第一步，其实要求真正的达到车规芯片的质量，还需要从设计开发流程体系，生产制造体系各个方面来把控，才能真正的满足汽车的质量要求。
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最前沿的电子设计资讯
