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TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTSpA3ednc |
|
#pA3ednc |
STRESSpA3ednc |
ABVpA3ednc |
SAMPLE SIZE / LOTpA3ednc |
|
A1pA3ednc |
PreconditioningpA3ednc |
PCpA3ednc |
77pA3ednc |
|
A2pA3ednc |
Temperature Humidity-Bias or Biased HASTpA3ednc |
THB or HASTpA3ednc |
77pA3ednc |
|
A3pA3ednc |
Autoclave or Unbiased HAST or Temperature Humidity (without Bias)pA3ednc |
AC or UHST or THpA3ednc |
77pA3ednc |
|
A4pA3ednc |
Temperature CyclingpA3ednc |
TCpA3ednc |
77pA3ednc |
|
A5pA3ednc |
Power Temperature CyclingpA3ednc |
PTCpA3ednc |
45pA3ednc |
|
A6pA3ednc |
High Temperature Storage LifepA3ednc |
HTSLpA3ednc |
45pA3ednc |
|
TEST GROUP B – ACCELERATED LIFETpA3ednc |
|
#pA3ednc |
STRESSpA3ednc |
ABVpA3ednc |
SAMPLE SIZE / LOTpA3ednc |
|
B1pA3ednc |
High Temperature Operating LifepA3ednc |
HTOLpA3ednc |
77pA3ednc |
|
B2pA3ednc |
Early Life Failure RatepA3ednc |
ELFRpA3ednc |
800pA3ednc |
|
B3pA3ednc |
NVM Endurance, Data Retention, and Operational LifepA3ednc |
EDRpA3ednc |
77pA3ednc |
|
TEST GROUP C – PACKAGE ASSEMBLY INTEGRITY TESTSpA3ednc |
|
#pA3ednc |
STRESSpA3ednc |
ABVpA3ednc |
SAMPLE SIZE / LOTpA3ednc |
|
C1pA3ednc |
Wire Bond ShearpA3ednc |
WBSpA3ednc |
30 bonds from a minimum of 5 devicespA3ednc |
|
C2pA3ednc |
Wire Bond PullpA3ednc |
WBPpA3ednc |
|
C3pA3ednc |
SolderabilitypA3ednc |
SDpA3ednc |
15pA3ednc |
|
C4pA3ednc |
Physical DimensionspA3ednc |
PDpA3ednc |
10pA3ednc |
|
C5pA3ednc |
Solder Ball ShearpA3ednc |
SBSpA3ednc |
5 balls from a min. of 10 devicespA3ednc |
|
C6pA3ednc |
Lead IntegritypA3ednc |
LIpA3ednc |
from each 10 leadspA3ednc
of 5 partspA3ednc |
|
TEST GROUP D – DIE FABRICATION RELIABILITY TESTSpA3ednc |
|
#pA3ednc |
STRESSpA3ednc |
ABVpA3ednc |
SAMPLE SIZE / LOTpA3ednc |
|
D1pA3ednc |
ElectromigrationpA3ednc |
EMpA3ednc |
---pA3ednc |
|
D2pA3ednc |
Time Dependent Dielectric BreakdownpA3ednc |
TDDBpA3ednc |
---pA3ednc |
|
D3pA3ednc |
Hot Carrier InjectionpA3ednc |
HCIpA3ednc |
---pA3ednc |
|
D4pA3ednc |
Negative Bias Temperature InstabilitypA3ednc |
NBTIpA3ednc |
---pA3ednc |
|
D5pA3ednc |
Stress MigrationpA3ednc |
SMpA3ednc |
---pA3ednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTSpA3ednc |
|
#pA3ednc |
STRESSpA3ednc |
ABVpA3ednc |
SAMPLE SIZE / LOTpA3ednc |
|
E1pA3ednc |
Pre- and Post-Stress Function/ParameterpA3ednc |
TESTpA3ednc |
AllpA3ednc |
|
E2pA3ednc |
Electrostatic Discharge Human Body ModelpA3ednc |
HBMpA3ednc |
See Test MethodpA3ednc |
|
E3pA3ednc |
Electrostatic Discharge Charged Device ModelpA3ednc |
CDMpA3ednc |
See Test MethodpA3ednc |
|
TEST GROUP E – ELECTRICAL VERIFICATION TESTS (CONTINUED)pA3ednc |
|
#pA3ednc |
STRESSpA3ednc |
ABVpA3ednc |
SAMPLE SIZE / LOTpA3ednc |
|
E4pA3ednc |
Latch-UppA3ednc |
LUpA3ednc |
6pA3ednc |
|
E5pA3ednc |
Electrical DistributionspA3ednc |
EDpA3ednc |
30pA3ednc |
|
E6pA3ednc |
Fault GradingpA3ednc |
FGpA3ednc |
---pA3ednc |
|
E7pA3ednc |
CharacterizationpA3ednc |
CHARpA3ednc |
---pA3ednc |
|
E9pA3ednc |
Electromagnetic CompatibilitypA3ednc |
EMCpA3ednc |
1pA3ednc |
|
E10pA3ednc |
Short Circuit CharacterizationpA3ednc |
SCpA3ednc |
10pA3ednc |
|
E11pA3ednc |
Soft Error RatepA3ednc |
SERpA3ednc |
3pA3ednc |
|
E12pA3ednc |
Lead (Pb) FreepA3ednc |
LFpA3ednc |
See Test MethodpA3ednc |
|
TEST GROUP F – DEFECT SCREENING TESTSpA3ednc |
|
#pA3ednc |
STRESSpA3ednc |
ABVpA3ednc |
SAMPLE SIZE / LOTpA3ednc |
|
F1pA3ednc |
Process Average TestingpA3ednc |
PATpA3ednc |
---pA3ednc |
|
F2pA3ednc |
Statistical Bin/Yield AnalysispA3ednc |
SBApA3ednc |
---pA3ednc |
|
TEST GROUP G – CAVITY PACKAGE INTEGRITY TESTSpA3ednc |
|
#pA3ednc |
STRESSpA3ednc |
ABVpA3ednc |
SAMPLE SIZE / LOTpA3ednc |
|
G1pA3ednc |
Mechanical ShockpA3ednc |
MSpA3ednc |
15pA3ednc |
|
G2pA3ednc |
Variable Frequency VibrationpA3ednc |
VFVpA3ednc |
15pA3ednc |
|
G3pA3ednc |
Constant AccelerationpA3ednc |
CApA3ednc |
15pA3ednc |
|
G4pA3ednc |
Gross/Fine LeakpA3ednc |
GFLpA3ednc |
15pA3ednc |
|
G5pA3ednc |
Package DroppA3ednc |
DROPpA3ednc |
5pA3ednc |
|
G6pA3ednc |
Lid TorquepA3ednc |
LTpA3ednc |
5pA3ednc |
|
G7pA3ednc |
Die ShearpA3ednc |
DSpA3ednc |
5pA3ednc |
|
G8pA3ednc |
Internal Water VaporpA3ednc |
IWVpA3ednc |
5pA3ednc
满足AEC-Q100仅仅只是车规芯片的第一步，其实要求真正的达到车规芯片的质量，还需要从设计开发流程体系，生产制造体系各个方面来把控，才能真正的满足汽车的质量要求。
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最前沿的电子设计资讯
